Immersion and Direct-to-Chip Cooling for Data Centers
Not all Data Centers are Created Equal
Solutions Designed for Your Unique Facility
The proliferation of data centers is accelerating, driven by the escalating demand for digital services and cloud computing. These facilities, critical for storing and processing vast amounts of data, underpin modern businesses and technologies. Looking ahead, innovations in AI and edge computing promise to enhance efficiency and reduce latency, meeting the evolving needs of global connectivity. Despite challenges such as sustainability and cybersecurity, the data center industry is poised for continued growth and transformation, shaping the future of digital infrastructure worldwide.
The rapid advancement of processors, coupled with their increasing heat generation, has made liquid cooling a necessity in modern data centers. As CPUs and GPUs become more powerful and densely packed, traditional air-cooling methods struggle to dissipate heat effectively, leading to performance bottlenecks and potential hardware failures. Liquid cooling applications directly absorb and transport heat away from components, offering superior thermal management and energy efficiency. This technology not only enables higher processing speeds and denser server configurations but also contributes to reducing overall energy consumption and operational costs. As data centers continue to scale and demand intensifies for faster and more reliable computing, liquid cooling solutions are set to play a crucial role in maintaining optimal performance and reliability.
Dynalene’s direct liquid cooling (DLC) and direct-to-chip (DTC) solutions are pioneering advancements in data center thermal management. Direct liquid cooling involves circulating a liquid coolant across entire server racks or data center infrastructures, efficiently dissipating heat and maintaining optimal operating temperatures. This approach improves energy efficiency and enables denser server configurations, crucial for modern computing demands. Direct-to-chip cooling takes a different approach by directly cooling individual components at their source, preventing thermal throttling and prolonging hardware lifespan. These innovative solutions not only enhance performance but also reduce the physical footprint of cooling systems, contributing to environmental sustainability and cost savings.
As data centers continue to scale up and demand for faster processing grows, Dynalene’s technologies are poised to play a pivotal role in meeting these challenges effectively and efficiently.
Direct to Chip / Direct Liquid Cooling Glycols
Ethylene glycol-based low electrical conductivity heat transfer fluids for fuel cell and electronics cooling applications
Propylene glycol-based low electrical conductivity heat transfer fluids for fuel cell and electronics cooling applications
BioGlycol-based low electrical conductivity heat transfer fluids for fuel cell and electronics cooling applications
Dielectric Fluids for Immersion Cooling
Synthetic hydrocarbon fluid
(32°F to 600°F) / (0°C to 315°C)
Synthetic hydrocarbon fluid
(68°F to 662°F) / (20°C to 350°C)
Synthetic hydrocarbon fluid
(32°F to 662°F) / (0°C to 350°C)
Non-toxic aliphatic hydrocarbon fluid
(32°F to 400°F) / (0°C to 205°C)
Other Coolants
Propylene glycol heat transfer fluids
(-50°F to 350°F) / (-46°C to 177°C)
Ethylene glycol heat transfer fluids
(-60°F to 350°F) / (-51°C to 177°C)
Propylene glycol heat transfer fluid with aluminum inhibitor
-45°C (-50°F) / 90°C (194°F)
+1 (610) 262-9686 for more information
Whether your data center is co-located, carrier neutral, or dedicated, we have the experience and resources to support your needs. We offer a free fluid maintenance program, filtration, R&D and much more. Dynalene will work with you to find the optimal fluids and accessories for your application to help make your implementation a success
